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U.S. Department of Labor
Industri: Government; Labor
Number of terms: 77176
Number of blossaries: 0
Company Profile:
A professional who performs any combination of following tasks to process materials into finished or semifinished electronic components. Respnsibilities include: * Reads work orders, formulas, and processing charts, and receives verbal instructions to determine specifications and sequence of operations. * Weighs or measures specified ingredients and binding agents, using scales and graduates. * Mixes and grinds material, using manual or automatic machines and equipment. * Loads, unloads, monitors operation, and adjusts controls of various processing machines and equipment that bake, diffuse, cast, x ray, cut, polish, coat, plate, silk screen, and perform similar operations to prepare, combine, or change structure of materials to produce compositions with specific electronic properties. * Cleans materials as required prior to processing operations, using solvents. * Inspects, measures, and tests components according to specifications, using measuring instruments and test equipment. * Encloses components in housings. * Stamps or etches identifying information on finished component. * Counts, sorts, and weighs processed items. * Maintains manual or computerized records of production and inspection data. * May be designated according to duties performed as beads baker; firer; pellet-preparation operator; preforming-machine operator; vacuum-evaporation operator; weight-count operator. * Assembly of processed materials, parts, and components is covered under electronics assembler and electronics assembler, developmental.
Industry:Professional careers
A professional who performs any combination of following tasks to print and etch conductive patterns on copper-faced plastic, fiberglass, or epoxy board to fabricate printed circuit boards (PCB's). Respnsibilities include: * Cuts board to designated size, using sheet metal shears, following written or verbal instructions. * Sands board and either places board in vapor degreaser or immerses board in chemical solution to clean and remove oxides and other contaminants. * Sprays or brushes light-sensitive enamel on copper surface and places board in whirler machine to spread enamel evenly, or tends machine that flows light-sensitive resist over board. * Laminates light-sensitive dry film to board, using heat and pressure equipment. * Exposes board and circuit negative to light in contact printer for specified period of time to transfer image of circuit to board. * Immerses exposed board in solution to develop acid-resistant circuit pattern on surface. * Compares board to sample to verify development of pattern. * Applies acid resist over sections of pattern not developed, using brush. * Immerses board in acid or tends etching machine to etch conductive pattern on copper surface. * Immerses board in solution to dissolve enamel. * Drills holes in board, using drill press, following work sample, drawing, and diagrams. * Installs hardware, such as brackets, eyelets, and terminals, using eyelet machine and hand arbors. * Reduces circuit artwork prior to printing onto board, using reduction camera. * Prints conductive pattern onto board, using silk screen printing device. * Fabricates PCB used as prototype of production model.
Industry:Professional careers
A professional who performs any combination of following tasks to process materials used in manufacture of electronic semiconductors. Respnsibilities include: * Saws, breaks, cleans, and weighs semiconductor materials to prepare materials for crystal growing. * Forms seed crystal for crystal growing, using x-ray equipment, drill, and sanding machine. * Loads semiconductor material, seed crystal, and dopant into crystal growing furnace and monitors furnace to grow crystal ingot of specified characteristics. * Grinds ingot to attain specified diameter and cylindricity, using grinding machine. * Locates crystal axis of ingot, using x-ray equipment, and grinds flat on ingot. * Saws ingot into wafers, using power saw. * Etches, laps, polishes, and heat treats wafers to produce wafers of specified thickness and finish, using etching equipment, lapping and polishing machines, and furnace. * Cleans materials, seed crystals, ingots, and wafers, using cleaning, etching, and sandblasting equipment. * Inspects materials, ingots, and wafers for surface defects. * Measures dimensions of ingots and wafers, using precision measuring instruments. * Tests electrical characteristics of materials, ingots, and wafers, using electrical test equipment.
Industry:Professional careers
A professional who immerses semiconductor wafers in series of chemical baths to etch circuitry patterns into or to strip excess photoresist from wafer surfaces. Respnsibilities include: * Places semiconductor wafers in containers, such as boats or cassettes, using vacuum wand or tweezers. * Immerses loaded containers in series of chemical and water baths to etch circuitry patterns into or strip excess photoresist from wafer surfaces. * Places loaded container into air or spin dryer and pushes buttons to activate drying cycle. * May visually inspect etched and stripped wafer, using microscope, to detect scratches, contaminants, and to verify conformance to specifications. * May tend plasma (gas) etch machine to etch circuitry patterns into wafer surfaces. * May clean and maintain chemical baths.
Industry:Professional careers
A professional who performs any combination of following tasks involved in cleaning, sorting, breaking, weighing, and packaging chunks of silicon for crystal growing. Respnsibilities include: * Sandblasts chunks of silicon or immerses chunks in cleaning tanks to remove contaminants. * Breaks chunks of silicon into pieces of specified size, using hammer. * Tests and sorts silicon pieces according to resistivity type and level, using resistivity device or meter. * Weighs out specified amounts of silicon to prepare charges (specified amounts of materials) for crystal growing process, loads silicon into charge can, and records identifying information on label of charge can. * May transport charges to crystal growing department.
Industry:Professional careers
A professional who performs any combination of following tasks to clean production photo mask plates used in fabrication of semiconductor devices. Respnsibilities include: * Reads specifications sheet to verify type of photo mask plate and number of production runs for each plate. * Marks number of production runs on border of each photo mask plate, using diamond scribe. * Immerses photo mask plates into series of chemical baths to strip photoresist from photo mask. * Places photo mask plates in chamber of specified cleaning machine and starts machine that automatically cleans and dries photo mask plates. * Places photo mask plates in chamber of coating machine and starts machine that automatically deposits specified coating onto photo mask. * Monitors operation of machines. * Inspects photo mask plates for defects or insufficient cleaning, using microscope. * Records process and inspection information in logbook.
Industry:Professional careers
A professional who performs any combination of following tasks to prepare polysilicon for crystal growing process. Respnsibilities include: * Operates drilling machine to remove core sample from polysilicon rod for evaluation. * Breaks polysilicon rod into chunks, using hammer. * Removes tungsten filament from chunks, using circular saw or drill. * Immerses polysilicon chunks into series of vats containing chemical solutions to remove contaminants, using steel basket and hoist. * Breaks chunks of polysilicon into pieces, using hammer, to prepare polysilicon for meltdown in crystal growing process. * Records production information.
Industry:Professional careers
A professional who performs any combination of following tasks to fabricate integrated circuits on semiconductor wafers according to written specifications. Respnsibilities include: * Loads semiconductor wafers into processing containers for processing or into inspection equipment, using tweezers or vacuum wand. * Cleans and dries photo masks and semiconductor wafers to remove contaminants, using cleaning and drying equipment. * Inspects photo masks and wafers for defects, such as scratches, using microscope, magnifying lens, or computer-aided inspection equipment. * Deposits layer of photoresist solution on wafers, using automated equipment. * Aligns photo mask pattern on photoresist layer, exposes pattern to ultraviolet light, and develops pattern, using specialized equipment. * Alters electrical nature of wafer layers according to photo mask patterns to form integrated circuits on wafers, using equipment, such as acid baths, diffusion furnaces, ion implant equipment, and metallization equipment. * Removes photoresist from wafers, using stripping chemicals and equipment. * Inspects and measures circuitry for conformance to pattern specifications, using microscope with measuring attachment. * Tests functioning of circuitry, using electronic test equipment and standard procedures.
Industry:Professional careers
A professional who performs any combination of following tasks to fabricate integrated circuits on semiconductor wafers according to written specifications. Respnsibilities include: * Loads semiconductor wafers into processing containers for processing or into inspection equipment, using tweezers or vacuum wand. * Cleans and dries photo masks and semiconductor wafers to remove contaminants, using cleaning and drying equipment. * Inspects photo masks and wafers for defects, such as scratches, using microscope, magnifying lens, or computer-aided inspection equipment. * Deposits layer of photoresist solution on wafers, using automated equipment. * Aligns photo mask pattern on photoresist layer, exposes pattern to ultraviolet light, and develops pattern, using specialized equipment. * Alters electrical nature of wafer layers according to photo mask patterns to form integrated circuits on wafers, using equipment, such as acid baths, diffusion furnaces, ion implant equipment, and metallization equipment. * Removes photoresist from wafers, using stripping chemicals and equipment. * Inspects and measures circuitry for conformance to pattern specifications, using microscope with measuring attachment. * Tests functioning of circuitry, using electronic test equipment and standard procedures.
Industry:Professional careers
A professional who tends machine that feeds molded floor covering into stove for heat-treating. Respnsibilities include: * Positions roll of floor covering on spindle of machine, using power hoist. * Threads floor covering through rollers and attaches cable that pulls floor covering into stove. * Presses foot brake to control feed of material. * Removes empty spindle from stand, replaces it with full roll, and attaches material to end of previous roll.
Industry:Professional careers
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