A professional who operates grinding machine to abrade semiconductor crystal ingot to improve cylindrical shape of ingot and attain specified diameter. Responsibilities include:

• Reads work order to determine target diameter of ingot.
• Measures ingot diameter, using calipers or micrometer, and calculates thickness of material to be removed from ingot and length of grinding time.
• Positions and secures ingot in trunnions or brackets on grinding machine.
• Adjusts machine controls for position of grinding tool and speed of grinding.
• Pushes buttons to activate coolant flow, rotation of ingot, grinding tool, and timer.
• Measures ingot diameter after grinding and continues grinding to attain specifications for diameter.
• May change worn grinding tools and other parts and adjust machine, using handtools.
• May attach graphite pieces to ends of ingot before grinding, using epoxy, and remove graphite and epoxy from ingot after grinding, using radiant oven and solvent.
• May operate saw to cut sample wafer from ingot for inspection.
• May perform routine maintenance on grinding machine, such as adding oil and cleaning machine.
• May operate flat grinding machine to grind flat along length of ingot and be designated crystal flat grinder.