A professional who operates precision saws to slice wafers from semiconductor crystal ingots, such as silicon or gallium arsenide. Responsibilities include:

• Attaches mounted crystal to holding fixture of automatic feed on saw, using clamps.
• Adjusts saw controls to set speed and angle of saw blade, thickness of cut, and angle of holding fixture.
• Operates saw to cut sample wafer from crystal ingot.
• Measures crystal orientation of sample wafer, using x-ray machine, and measures thickness of sample wafer, using calipers or thickness gauge.
• Inspects sample wafer for flaws, such as saw marks, chips, bow, and taper.
• Readjusts saw controls based on measurements and inspection.
• Starts saw and observes operation of saw to ensure wafers are sliced according to specifications.
• Removes sliced wafers from saw and cleans wafers in sink or ultrasonic cleaner.
• May mount crystal ingot to mounting block.
• May be designated according to type of saw operated as v-block saw operator; wire saw operator.