A professional who tends abrading machines that roughen surface of semiconductor wafers to distinguish front from back. Responsibilities include:

• Adjusts controls to set speed, time, and pressure of abrading belts according to specifications.
• Loads container of wafers into abrading machine and starts machine that automatically abrades surface of wafer.
• Removes abraded wafers from machine and inspects wafers to detect abrading defects, such as cracks, using microscope.
• Replaces worn abrading belts.